| abstract |
[Problem] A resin composition capable of obtaining a cured product in which the occurrence of warpage is suppressed; a resin sheet containing the resin composition; A printed wiring board provided with the insulating layer formed using the said resin composition, and provision of a semiconductor device. [Solutions] A resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the component (A) contains an epoxy resin having a hyperbranched structure. |