| abstract |
According to the present invention, (A) an epoxy resin, (B) a curing agent, and (C) a resin composition for sealing containing a filler, the epoxy resin (A) is an epoxy resin (A-1) having a naphthyl ether skeleton ), the glass transition temperature of the cured product of the resin composition for sealing is Tg (°C), the coefficient of linear expansion at 190°C to 230°C is α 2 (ppm/°C), and the thermal elastic modulus at 260°C is E 2 (MPa), when the rectangular pressure at 175 ° C. of the resin composition for sealing measured by the following method is η 2 (MPa), the resin composition for sealing which satisfies the following formula (1) is provided do. Equation (1) E 2 ×(α 2 ×10 -6 )×(175-Tg)×η 2 ≤0.3 (Way) Using a low-pressure transfer molding machine, the resin composition for sealing is injected into a rectangular flow path having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under the conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm 3 /sec, and 25 mm from the upstream end of the flow path. The change of pressure with time is measured with the pressure sensor embedded in the position, the minimum pressure (MPa) at the time of the flow of the said resin composition for sealing is measured, and let this be a rectangular pressure. |