| abstract |
The hollow package 103 includes a substrate 109 , an element 111 , a partition wall 113 , and a top plate 115 , and one or more closures covered with the substrate 109 , the partition wall 113 and the top plate 115 . The hollow part 117 is provided, and the substrate 109, the partition wall 113, and the top plate 115 are sealed with a cured product of the sealing resin composition. Both the top plate 115 and the partition wall 113 are made of an organic material, and the thickness of the top plate 115, the thickness of the partition wall 113, the width of the partition wall, and the longest width of the hollow part 117 are within specific ranges, respectively. is in The resin composition for sealing, (A) an epoxy resin containing two epoxy groups in a molecule and an epoxy resin containing three or more epoxy groups in a molecule, an epoxy resin containing one or two or more selected from the group consisting of; B) Contains inorganic fillers. |