| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fda353b84ebf303bfc237d8bd8e22966 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02W30-62 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2019-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2bb3cb559be3aa92e4c340d470cc040
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5772e77cedf39d5dd28775ff557a2099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b33dff4ecb45cb2faa0f687a3afb00b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5430cc60dfc62e522cafd53c8025d60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b5ce8de7c9583b5d4ee468fc423bcb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31f11770c497b0d8a85f766ff4110dcc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94265c39bc958746f9a003f9924a2b14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba6048709f6ef97f7896ad435d197ec7 |
| publicationDate |
2021-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210095628-A |
| titleOfInvention |
Method for manufacturing a semiconductor device, a light-absorbing laminate, and a laminate for temporarily fixing |
| abstract |
The process of processing the semiconductor member temporarily fixed through the temporarily fixing material layer with respect to the supporting member, and irradiating incoherent light from the supporting member side with respect to the temporarily fixing laminate, thereby separating the semiconductor member from the supporting member. A method of manufacturing a semiconductor device provided in this order is disclosed. Part or all of the temporarily fixed material layer is a light absorption layer that absorbs light to generate heat. The transmittance of the support member with respect to the incoherent light is 90% or more. The transmittance of the temporary fixing material layer with respect to the incoherent light is 3.1% or less. |
| priorityDate |
2018-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |