| abstract |
An object of the present invention is to provide a random copolymer compound and a terminal-modified polymer compound having excellent film-forming ability, high heat resistance and adhesiveness, and low dielectric constant and dielectric loss tangent. That is, as a random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxyl groups at both terminals, (B) an aliphatic polymer having alcoholic hydroxyl groups at both terminals, and (C) an acid dichloride compound as a binder, (A) The number of moles of the polyphenylene ether resin a, the number of moles of the (B) aliphatic polymer, b, and the number of moles, c, of the acid dichloride compound as the binder (C) A random air satisfying the relationship (a+b)>c Copolymer compounds are disclosed. |