| abstract |
A solder ball, which is an aspect of the present invention, is provided between a metal core including a first metal and a solder layer, and includes a coating layer including a second metal different from the first metal, and the first metal is disposed in at least one region of the coating layer. It includes a first diffusion region that diffuses to form an alloy with the second metal, and since the magnetism of the second metal having magnetism is weakened when the alloy is formed, the sticking phenomenon that occurs due to the magnetism of the solder ball when used in an electronic component package is prevented. It is characterized in that it provides a low-magnetic solder ball and a method for manufacturing the same. |