| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5381 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2020-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97d033f17d52bc47853210bb485ea200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b01f58a7a58db55aa8c22e92c3465ae7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf973ae675658bbc956da7d68c8fd75c |
| publicationDate |
2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210081226-A |
| titleOfInvention |
Embedded die architecture and method of making |
| abstract |
Various examples provide a semiconductor package. A semiconductor package includes a substrate having first and second opposed substantially planar major surfaces extending in an x-y direction. The package further includes a bridge die having third and fourth opposed substantially planar major surfaces extending in the x-y direction. The third substantially planar major surface of the bridge die is in direct contact with the second substantially planar major surface of the substrate. The semiconductor package further includes a through silicon via extending in the z-direction through a first substantially planar major surface of the substrate and a fourth substantially planar major surface of the bridge die. The semiconductor package further includes a power source coupled to the through silicon via, a first electronic component electronically coupled to the bridge die, and a second electronic component electronically coupled to the bridge die. The semiconductor package further includes an over mold at least partially surrounding the first electronic component, the second electronic component, and the bridge die. |
| priorityDate |
2019-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |