| abstract |
A printed circuit board module according to various embodiments of the present disclosure includes a first printed circuit board including a base printed circuit board, a sidewall disposed on an outer side of the base printed circuit board, and conductive vias penetrating the sidewall, the a second printed circuit board disposed on the sidewall to cover a cavity defined by the sidewall of the first printed circuit board, disposed within the cavity and positioned on the first printed circuit board and/or the second printed circuit board a first layer including at least one electronic component, wherein the sidewall is disposed on the upper surface of the base printed circuit board and made of an insulating member; a second layer disposed on the first layer and including polyimide; the second layer A third layer disposed thereon and formed of an insulating member, and a fourth layer disposed on the third layer and including a conductive member in communication with the conductive vias. |