| abstract |
A MEMS packaging structure and a manufacturing method thereof, wherein the MEMS packaging structure includes MEMS chips (210, 220) and a device wafer (100), wherein the MEMS chip (210, 220) is a first surface (100a) of the device wafer (100) ), the MEMS chips 210 and 220 have closed micro-cavities 211 and 221 and contact pads 212 and 222 for connecting external electrical signals, and the device wafer 100 has a control unit and , contact pads 212 and 222 and an interconnection structure 300 electrically connected to all of the control unit is installed, and a redistribution layer electrically connected to the interconnection structure 300 is provided on the second surface 100b of the device wafer 400 is installed. The manufacturing method of the MEMS packaging structure is advantageous in reducing the size of the MEMS packaging structure by installing the MEMS chips 210 and 220 and the redistribution layer 400 on both sides of the device wafer 100, and is also the same or the same on the same device wafer. Multiple MEMS chips with different structures and functions can be integrated. |