| abstract |
A MEMS packaging structure and a manufacturing method thereof, wherein the MEMS packaging structure includes a MEMS chip 200 and a device wafer 100, wherein a control unit and an interconnection structure 300 are installed on the device wafer 100, and a device A first contact pad 410 and an input/output connection member 420 are installed on the first bonding surface 100a of the wafer 100 , and the MEMS chip 200 is connected to the first bonding surface 100a through the bonding layer 500 . ), the MEMS chip 200 has a micro-cavity 210 and a second contact pad 220, and the micro-cavity 210 of the MEMS chip 200 is a through hole 210a communicating with the outside. , wherein the first contact pad 410 is electrically connected to the corresponding second contact pad 220 , and the bonding layer 500 is provided with an opening 510 exposing the input/output connection member 420 . . The MEMS packaging structure can reduce the size of the packaging structure compared to the conventional integration method, and can also integrate various MEMS chips on the same device wafer, thereby improving the functional integration performance of the packaging structure. |