abstract |
An object of the present invention is to provide a resin composition suitable as a one-component adhesive for use in the manufacture of electronic components, which can be stably manufactured by reducing variations in characteristics and can improve productivity. The resin composition of the present invention comprises (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) at least one boric acid ester compound. Including anionic polymerization inhibitors. |