| abstract |
An integrated circuit (IC) device includes a first component, the first component including a first dielectric, and a plurality of adjacent first interconnect structures in the first dielectric. The IC device includes a second component, the second component including a second dielectric, and a plurality of adjacent second interconnect structures in the second dielectric. A second one of the second interconnect structures is in direct contact with a first one of the first interconnect structures at a bonding interface between the first component and the second component. A second first of the first interconnect structures is spaced apart from the plane of the bonding interface. |