| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_854de7644e0cfd570d92d85b1bf6e614 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2375-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-0009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-32 |
| filingDate |
2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4d1da625195775a5c61c40a5365f39c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98885e66a0c14598e4a9a047a4c5286f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4abfdc4e476de104d2195eb1115805b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d59275093c261bf34172e9b046cd15c |
| publicationDate |
2021-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210056679-A |
| titleOfInvention |
Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
| abstract |
The embodiment provides a polishing pad, a method for manufacturing the same, and a method for manufacturing a semiconductor device using the same. In the polishing pad according to the embodiment of the present invention, the average value of the modulus of the pore region and the non-pore region is adjusted to 0.5 GPa to 1.6 GPa, thereby realizing excellent life characteristics and improving scratches and surface defects appearing on the surface of the semiconductor substrate. And the polishing rate can be further improved. |
| priorityDate |
2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |