| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
| filingDate |
2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ad0b7ec2267dee402275933b248350a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54da82094b1751f7f59b8392a4634c6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65ece2663e55b3758529a62976be8e04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b51a1390252ae89556f9bcec3504f34d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e8a25a209af2ac1189a7bae216aefd5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f4411180d7f11ca88ad1e691fb4cf86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88969c960434f21e6fa1845eed3d5a4a |
| publicationDate |
2021-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210052086-A |
| titleOfInvention |
Thermal curable adhesive composition, composite structure having adhesive layer and its preparation method |
| abstract |
The present invention relates to a thermosetting adhesive composition that has excellent adhesive strength and enables the formation of an adhesive layer exhibiting improved impact strength in a wide temperature range including low temperatures, a structure including an adhesive layer formed using the same, and a method of manufacturing the same. The heat curable adhesive composition is an epoxy resin; An inorganic filler having a secondary particle form in which a plurality of primary particles are aggregated; A core-shell structured rubber copolymer comprising a core including a rubber polymer and a shell including a polymer cross-linked or graft-bonded to the core; Polyurethane resin including a polymer block derived from polyalkylene glycol; And a thermal curing agent capable of curing at a temperature of 80° C. or higher. |
| priorityDate |
2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |