| abstract |
The present invention is a laminate in which a primer layer (X), a metal layer (B), and a metal plating layer (C) are sequentially stacked on a support (A) containing a polyphenylene sulfide resin composition, and the primer layer (X) is an epoxy group. A laminate which is a layer containing an aromatic resin (x1) having a, a molded article using the laminate, a conductive pattern, and an electronic circuit are provided. This laminate is a laminate in which polyphenylene sulfide is used as a support and a metal plating layer is provided thereon, and has excellent adhesion to the metal plating layer, and also has heat resistance capable of maintaining excellent adhesion even when exposed to a high temperature environment. . |