| abstract |
Having a photosensitive resin composition for forming a resist pattern useful as a mask for plating treatment, a method for forming a resist pattern using the photosensitive resin composition, a method for producing a plated article using the resist pattern formed by the above forming method, and the plated article For the purpose of providing a semiconductor device, the photosensitive resin composition includes a structural unit (a1) represented by the following formula (a1), a structural unit (a2) represented by the following formula (a2), and a structural unit represented by the following formula (a3). A polymer (A) having (a3) and a photoacid generator (B) are contained. In formula (a3), R 33 represents a hydroxyaryl group. |