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filingDate 2018-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce856c092edf1f2e3d8b1cdf2a542b42
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publicationDate 2021-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20210043758-A
titleOfInvention Thin film formation method
abstract In the method of the present invention, the temperature of the object on which the film is formed is raised to at least 200° C., and the film is deposited on the object so that the film-forming material and the carrier gas are deposited on the object on which the film is formed. A first step of changing from a first state supplied to the object to be formed to a second state in which the supply of the film-forming material is omitted from the first state; And the hydrogen from a third state supplied to the object on which the film is formed so that the temperature of the object on which the film is formed is raised to at least 200°C, and hydrogen gas and a carrier gas reduce the film-forming material. And a second step for changing the supply of gas to a fourth state in which the supply of gas is removed from the third state. The film-forming material is any one material selected from the group consisting of Al(C x H 2x+1 ) 3 , Al(C x H 2x+1 ) 2 H and Al(C x H 2x+1 ) 2 Cl to be. An aluminum carbide film having an aluminum atomic content of at least 20 atomic% is formed on the surface of the object on which the film is formed by alternately repeating the first step and the second step.
priorityDate 2017-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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