| abstract |
A resin molded article for sealing an optical semiconductor capable of stably transfer molding with little fluctuation in the spiral flow length or gelation time, and a manufacturing method thereof are provided. According to EMMI (Epoxy Molding Materials Institute) standard 1-66, the standard deviation σ of the spiral flow length SF measured under the conditions of a mold temperature of 150℃, a molding pressure of 970kgf/㎠, a curing time of 120s, and an injection speed of 2.0cm/s ( SF) is a resin molded article for sealing optical semiconductors of 20 cm or less. |