| abstract |
The present invention is for a sputtering target capable of minimizing the inclusion of impurities due to a bonding layer, etc. in a film formation layer formed by sputtering, and a sputtering device having the same, a target material layer, and a target material layer, located on one side of the target material layer, and It provides a sputtering target and a sputtering apparatus including the same, including a bonding layer including a diffusion material that can be diffused when exposed. |