http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210037046-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_290a1ff0b819db4e111ed8afc53e0c97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate | 2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dbcbe7d69f810bab3ac9c27d76f54c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f64542af3bf1eef1e8dff7a3a2ba223a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95e847cbfa2dfd5418b1d1f48f8d562d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e003d41fba9f2e9b819de6dccc9358a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_493ddf337d5899c4d917e6d579e9f9da |
| publicationDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20210037046-A |
| titleOfInvention | SnAgCu electroplating solution for solder bump and solder bump manufactured by the same |
| abstract | The present invention is a tin-based electroplating solution for a solder pump, the electroplating solution is tin metal sulfonic acid; Silver metal sulfonic acid; Copper metal sulfonic acid; Metal sulfonic acid; Complexing agent; Antioxidants; And water; wherein the metal sulfonic acid tin contains an amount such that the tin atoms are at a concentration of 40 g/L to 105 g/L based on the total electroplating solution, and the silver methanesulfonic acid is based on the total electroplating solution. Includes an amount that makes the silver atom a concentration of 0.4 g/L to 7.5 g/L, and the copper methanesulfonate is an amount that makes the copper atom a concentration of 0.4 g/L to 20 g/L based on the total electroplating solution. Including, the concentration of the methanesulfonic acid is 70 g/L to 210 g/L based on the total electroplating solution, and the concentration of the complexing agent is 130 g/L to 350 g/L based on the total electroplating solution And, the concentration of the antioxidant is 0.1 g/L to 500 g/L based on the total electroplating solution, and a tin-silver-copper electroplating solution for solder bumps and a method of manufacturing a solder bump for a flip chip using the same Provides. |
| priorityDate | 2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.