| abstract |
A method and apparatus for packaging an ultrasonic-on-chip is disclosed. The ultrasound-on-chip can be bonded to the redistribution layer and interposer layer. The encapsulation portion may encapsulate the ultrasonic-on-chip device and the first metal filler extends through the encapsulation portion and may be electrically coupled to the redistribution layer. The second metal filler may extend through the interposer layer. The interposer layer may comprise aluminum nitride. The first metal filler may be electrically coupled to the second metal filler. A printed circuit board may be bonded to the interposer layer. |