| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2019-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba80b7fb0e7634e58bfe450f941f97ab |
| publicationDate |
2021-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210020899-A |
| titleOfInvention |
Harmonized copper foil, copper clad laminate and printed wiring board |
| abstract |
The present invention provides a roughened copper foil capable of significantly improving the heat-resistant peeling strength with a thermoplastic resin having a low dielectric constant. The present invention is a roughened copper foil having on at least one side a roughened surface composed of a needle-like crystal and/or a plate-shaped crystal containing copper oxide and/or copper oxide, wherein the roughened surface is subjected to continuous electrochemical reduction analysis (SERA) It relates to a roughened copper foil, wherein the copper oxide thickness determined by is 71 to 300 nm, and the copper oxide thickness determined by continuous electrochemical reduction analysis (SERA) is 0 to 20 nm. |
| priorityDate |
2018-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |