| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2019-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b09d20ac2c94f92940cf6df72b0edc02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec81b985ebdf4ed498566215a7549443
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6ec1799e8fbf089aab38c4e877f78cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f88185128706b931c8318e1c88bb770 |
| publicationDate |
2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210019752-A |
| titleOfInvention |
Composition for electroless copper plating and method for electroless plating using the same |
| abstract |
The present invention relates to a composition for electroless copper plating and an electroless plating method and product using the same. |
| priorityDate |
2019-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |