http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210003051-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cfd064bc0ee82359d196fab99a0adc1b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04M1-0202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20963 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133385 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2020-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f46b27740653ed6467cab2982dd5828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_487a2d1e40496c84ed7f2819c028aaf8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f784e6fef8a75acf2c03b2228d3d593a |
| publicationDate | 2021-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20210003051-A |
| titleOfInvention | Elastic heat-dissipation structure and electronic device |
| abstract | The elastic heat-dissipating structure includes a porous elastic member, and a plurality of first heat conductive members and a plurality of second heat conductive members. The first heat conductive members and the second heat conductive members are mixed in the porous elastic member. Each of the first heat conductive members has a maximum width ranging from 5 μm to 50 μm, each of the second heat conductive members has a maximum width ranging from 0 μm to 5 μm, and each of the first heat conductive members and the first heat conductive member 2 The thickness of each of the heat conductive members spans from 0.3 nm to 30 nm. When the density of the elastic heat-releasing structure is between 0.1 g/cm 3 and 1.0 g/cm 3 , the content of the first heat-conducting members and the second heat-conducting members ranges from 0.01% to 20%. An electronic device including the elastic heat-dissipating structure is also disclosed. |
| priorityDate | 2019-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.