| abstract |
It provides a flux for solder paste that makes it possible to suppress the occurrence of voids and a solder paste using the flux. The flux for solder paste contains a rosin, an imidazole compound, and a solvent, and contains 25 mass% or more and 35 mass% or less of an imidazole compound. Moreover, 0 mass% or more and 20 mass% or less of a blocked organic acid and 0 mass% or more and 3 mass% or less of an activator are contained. |