| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99cec0499ce1475468f8a11d8d05e3c5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-0436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-36 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K103-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M10-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
| filingDate |
2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_067eb406704be5c986846935c9b1bad2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dea5168a40e0b1b3344ac586d94108c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d1da840ca98e34ab6f2934225509e3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffcc20de406b5b9d3b22ff5d34393614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_129d3e42e1278a99d3b70a27a369b66c |
| publicationDate |
2020-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200136391-A |
| titleOfInvention |
Laser processing method for thin film structures |
| abstract |
A method of processing a thin film structure comprises: providing a thin film structure comprising a stack of two or more thin film layers supported on a surface of a substrate, the stack having a depth orthogonal to the substrate surface; And by using a direct write laser technique to scan the laser beam along the desired cutting line on the surface of the stack and along the scan path covering the area of the cutting line to ablate the material of the stack to at least the surface of the substrate through the depth of the stack. Forming a cut through the depth of the stack, wherein the direct write laser technique has a duration of less than 1000 femtoseconds at a wavelength in the range of 100 to 1500 nm and produces a fluence in the range of 50 to 100,000 mJ/cm 2 . Implemented using ultrashort pulsed laser output pulses to deliver. |
| priorityDate |
2018-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |