| abstract |
The method includes bonding a second package component to a first package component, bonding a third package component to a first package component, attaching a dummy die to the first package component, a second package component, and a third Encapsulating the package component, and the dummy die in the sealant, and performing a planarization process to bring the top surface of the second package component flush with the top surface of the sealant. After the planarization process, the top of the sealant overlaps the dummy die. A dummy die is saw-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The top of the sealant is also saw-through. |