| abstract |
A curable composition excellent in heat resistance and dielectric properties in a cured product, a cured product of the curable composition, a printed wiring board using the curable composition, a semiconductor encapsulating material, and a build-up film are provided. Specifically, a curable composition containing a polymerizable unsaturated bond-containing aromatic ester compound (A) and a polyarylene ether resin (B), a cured product of the curable composition, a printed wiring board using the curable composition, and a semiconductor sealing material , Provide build-up film. |