| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-1704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-1704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-005 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate |
2019-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a307842c12dac7fdd61e50957e717a64 |
| publicationDate |
2020-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200120703-A |
| titleOfInvention |
Polyamide composition for liquid assisted injection molding applications |
| abstract |
The present invention relates to a polyamide composition, the polyamide composition (i) at least one aliphatic polyamide containing repeating units derived from polycondensation of hexamethylenediamine and adipic acid; (ii) at least one semiaromatic polyamide comprising repeating units derived from polycondensation of hexamethylenediamine, adipic acid and at least one aromatic dicarboxylic acid; (iii) one or more fibrous fillers; (iv) one or more particulate fillers; (v) one or more thermal stabilizers; And (vi) one or more additional additives Includes. The polyamide composition exhibits excellent processing properties in the manufacture of articles using a liquid assisted injection molding process. |
| priorityDate |
2018-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |