http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200115264-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ca4a4e36e37395a0133b2c18f5c533b5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2077-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C41-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-02 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K77-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J11-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b73970cfc93260be51f68d0797138e7e |
| publicationDate | 2020-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20200115264-A |
| titleOfInvention | Method for producing polyimide film and method for producing metal clad laminate |
| abstract | [Problem] Provides a method of efficiently obtaining a polyimide film while recovering and reusing a raw material solvent used in production without deteriorating physical properties. [Solution means] A first heat treatment step of heating a solution of polyamic acid containing a raw material solvent to form a resin film of polyamic acid, and a second heat treatment step of imidizing by heating at a higher temperature. 1 The highest temperature (T1max) in the heat treatment step and the boiling point (Tb) of the raw material solvent satisfy 0.5Tb<T1max<Tb, the content of the raw material solvent contained in the resin film is 10 to 50% by mass, and the second heat treatment step The maximum temperature at is higher than the Tb, the content of the raw material solvent contained in the polyimide film is less than 1% by mass, the thermal expansion coefficient of the polyimide film is 10 to 30 ppm/K, and recovered in the first heat treatment step It is a manufacturing method of a polyimide film reused as a solvent. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230052524-A |
| priorityDate | 2019-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 184.