| abstract |
[Problem] A resin composition having excellent dielectric loss tangent and adhesiveness to a conductor layer, an insulating layer capable of suppressing warpage, and having a low minimum melt viscosity; A resin sheet containing the resin composition; Provision of a printed wiring board including an insulating layer formed using the resin composition, and a semiconductor device. [Solution means] (A) epoxy resin, (B) inorganic filler, (C-1) elastomer, and (C-2) an alkyl group having 5 or more carbon atoms which may have a substituent, and the number of carbon atoms which may have a substituent A resin composition comprising a maleimide compound containing at least any one hydrocarbon chain among 5 or more alkylene groups. |