| abstract |
A resin composition and a soldering flux capable of suppressing cracking of the residue are provided. The resin composition includes hydrogen in dimer acid, a reaction product of oleic acid and linoleic acid, trimer acid, which is a reaction product of oleic acid and linoleic acid, hydrogenated dimer acid, which is a reaction product of oleic acid and linoleic acid, and trimer acid, which is a reaction product of oleic acid and linoleic acid. Hydrogenated dimer acid in which hydrogen is added to the amount of any of the hydrogenated trimer acids added, or dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, dimer acid which is a reaction product of oleic acid and linoleic acid, and The ratio of the total amount of two or more types of hydrogenated trimer acids obtained by adding hydrogen to trimer acid, which is a reaction product of oleic acid and linoleic acid, and the amount of rosin, is 0.15 or more and 1.00 or less based on rosin. The flux for soldering is obtained by diluting a resin composition with a solvent. |