| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 |
| filingDate |
2018-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_350fc3e2dd75fda4066abd35194408a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9ef2de8b4a88550e85493ca4e7b7add |
| publicationDate |
2020-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200090207-A |
| titleOfInvention |
Copper foil for heat dissipation and heat dissipation member |
| abstract |
Provided is a copper foil for heat dissipation having excellent heat dissipation properties. When the copper foil base material has a plating treatment layer on at least any major surface of the copper foil base material and the plating treatment surface of the plating treatment layer is measured using a laser microscope, the projection area A of the plating treatment surface The copper foil for heat dissipation, wherein the surface area ratio B/A of the surface area B of the plating surface with respect to is 1.42 to 3.42. |
| priorityDate |
2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |