http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200086631-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-50
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2020-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_084259bcac48307cf7a5808e49717143
publicationDate 2020-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20200086631-A
titleOfInvention Method of forming nitride film and apparatus for forming nitride film
abstract The present invention provides a technique capable of forming a nitride film at a low temperature, and further reducing damage to the underlying substrate on which the nitride film is to be formed. The step of forming a layer containing the element on the substrate by supplying a source gas containing an element to be nitrided to the substrate, and plasma-forming the reformed gas containing hydrogen gas. The process comprising the step of modifying the layer containing the element and the step of thermally activating the nitriding gas containing nitrogen with the heat-activated nitriding gas, and the step of thermally nitriding the layer containing the element is repeated a plurality of times. , Nitride film formation method.
priorityDate 2019-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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