http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200080129-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-1253 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate | 2019-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c87d1be7f6575f575cdde51e7973f5cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df3ebdfec9639fd9b2d189ee503ca7ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd7a3f69ad120ab203d9c8a923c6c38e |
publicationDate | 2020-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20200080129-A |
titleOfInvention | Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing electronic component |
abstract | (Task) An adhesive composition having high heat resistance and easy removal of an adhesive layer, a laminate produced using the adhesive composition, a method of manufacturing the laminate, and a method of manufacturing an electronic component using the adhesive composition are provided. (Solution means) An adhesive composition used to form an adhesive layer for temporarily adhering a semiconductor substrate or an electronic device to a support, wherein the adhesive composition forms a crosslinked structure by heat and is cured to perform the temporary adhesion, and the crosslink The adhesive composition, wherein the structure is decomposed by acid or alkali, and the adhesive layer is removed during or after the decomposition process. |
priorityDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 238.