http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200074860-A

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filingDate 2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab482a47b0649c3cc8b552394b01332a
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publicationDate 2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20200074860-A
titleOfInvention Conductive film
abstract (Task) A conductive film capable of suppressing the occurrence of disconnection during patterning of a metal layer is provided even when a relatively thin metal layer is formed. (Solution) A first metal layer and a resin film are provided in this order, the thickness of the first metal layer is 10 nm or more and 200 nm or less, and the surface roughness Rz of the surface opposite to the resin film of the first metal layer is Rz. Conductive film having a thickness of 100 nm or less. It is preferable that the surface roughness Ra of the surface opposite to the first metal layer of the resin film is 30 nm or less.
priorityDate 2018-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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