| abstract |
High-sensitivity, low-tapered pattern can be formed after development, it is possible to suppress a change in the pattern opening dimension width before and after thermal curing, and a cured film excellent in light shielding properties and a negative photosensitive resin forming the same It aims at obtaining a composition. (A) alkali-soluble resin, (C1) photopolymerization initiator, and (Da) black agent, (A) alkali-soluble resin, (A1-1) polyimide, (A1-2) polyimide precursor, (A1 -3) a structural unit having a fluorine atom and containing a first resin (A1) containing at least one selected from the group consisting of polybenzoxazole and (A1-4) polybenzoxazole precursor It is a negative photosensitive resin composition which has a ratio and (C1) photopolymerization initiator contains the (C1-1) oxime ester-type photopolymerization initiator of a specific structure. |