| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2019-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fd396982571291ceb4307e5518a538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9ac9da62dbd89f7f9306efbf84c9a94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a12b3e1ed4253e7bb6782495c9bbde47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d |
| publicationDate |
2020-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200068589-A |
| titleOfInvention |
Dicing die bond film |
| abstract |
Providing DDAF suitable for securing sufficient cuff width with respect to the cut-off point between chips while realizing good cut in the expanding process performed using a dicing die bond film (DDAF) to obtain a semiconductor chip with a die bond film. do. The DDAF of the present invention has a laminated structure comprising a die bond film 10 and a dicing tape 20. The die bond film 10 is adhered to the pressure-sensitive adhesive layer 22 of the dicing tape 20 so as to be peelable. The die bond film 10 has an elongation at break of 20% or less in a tensile test performed under predetermined conditions. The die-bonding film 10 has a disk shape having a diameter D 1 , and includes a wafer bonding region having the disk shape and a diameter D 2 of concentric circles. D 1 and D 2 satisfy 0<(D 1 -D 2 )/D 2 <1. Moreover, the elongation at break in the tensile test performed on predetermined conditions of the dicing tape 20 is 120% or more. |
| priorityDate |
2018-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |