| abstract |
(1) A resin composition used for bonding at least two optical substrates, comprising an intramolecular hydrogen drawing type photopolymerization initiator (A), a photopolymerizable oligomer (B), and a (meth)acrylate monomer (C), The content ratio of the solvent in the resin composition is 5% by weight or less, the weight average molecular weight of the photopolymerizable oligomer (B) is in the range of 7000 to 100,000, and the cured product of the resin composition is in the wavelength range of 450 to 800 nm. UV-curable adhesive composition having a light transmittance of 85% or more. |