| abstract |
A method of electroplating metal into features of an electronic device partially fabricated on a substrate is provided. The method comprises the steps of: (a) while contacting features with a first electroplating bath having a first composition and containing ions of metal, electroplating the metal into the features to partially fill the features by a bottom up filling mechanism; (b) thereafter, while contacting the features with a second electroplating bath having a second composition different from the first composition and containing ions of the metal, electroplating more metal into the features to fill the features further step; And (c) removing the substrate from the electroplating tool in which step (b) was performed. |