| abstract |
[Task] A resin composition capable of forming a cured product having low dielectric loss tangent, excellent smear removal, and excellent adhesion strength between a conductor layer; A resin sheet comprising the resin composition; A printed wiring board comprising a cured product of the resin composition; And providing the printed wiring board. [Solutions] At least one of (A) an epoxy resin, (B) a maleimide compound, and (C) a component, and (B) the component has an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. A maleimide compound containing a hydrocarbon chain, wherein the component (C) is at least one compound selected from the group consisting of (C-1) benzoxazine compound and (C-2) carbodiimide compound. |