| abstract |
The present invention relates to an epoxy resin composition and a prepreg, a laminate and a printed circuit board using the same. The epoxy resin composition of the present invention includes an epoxy resin (A), a maleimide compound (B) having a structure of formula (I), and an active ester compound (C). Prepregs, laminates (including metal foil laminates) and printed circuit boards manufactured using them have low dielectric constant (Dk) / dielectric loss tangent value (Df), high glass transition temperature (Tg), low absorption, low coefficient of thermal expansion (CTE) ), Excellent heat resistance and moisture heat resistance. |