| abstract |
Disclosed is a die bonding apparatus, substrate bonding apparatus, die bonding method, and substrate bonding method capable of bonding a die to a substrate or bonding substrates without using a bonding medium such as an adhesion film and a solder bump. do. A die bonding method according to an embodiment of the present invention includes a die bonding method for bonding a die on a substrate, comprising: hydrophilizing the bonding surface of the die to be bonded on the substrate by plasma treatment; Forming a liquid film on the bonding region by supplying a liquid containing water to a bonding region on the substrate to be bonded to the die; Temporarily contacting the die on the substrate by contacting the die on the liquid film by a bonding force between the hydrophilized bonding surface of the die and the liquid film; And heat-treating in a state where one or more dies are temporarily bonded on the substrate to simultaneously bond the one or more dies on the substrate at the same time. |