http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200044481-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-642 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-38 |
| filingDate | 2018-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34ae8c060ab3b8208e7f8aa7d6c1fdd9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95eecc2cfe61b77a7e0ea9625c025988 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e681c99d012dea99544894b98cd053a |
| publicationDate | 2020-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20200044481-A |
| titleOfInvention | Light emitting device package and lighting apparatus including the same |
| abstract | An embodiment relates to a light-emitting device package capable of high-density placement and a lighting device including the same, which includes a body having a cavity, a light-emitting chip disposed in the cavity, and a plurality of metal pads disposed on a lower surface of the body, and The metal pads of the first and second electrode pads electrically connected to the light emitting chip and the first and second electrode pads are wrapped around the first and second electrode pads so that only one of the side surfaces of the first and second electrode pads is opened. It may include a plurality of heat dissipation pads disposed. Accordingly, according to the embodiment, by arranging a plurality of heat dissipation pads around the first and second electrode pads, the heat dissipation pad may serve as an intermediate connection path of the circuit wiring or perform heat dissipation depending on the electrical connection of the circuit wiring. As a result, high-density placement is possible, and circuit wiring can be easily formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113809112-A |
| priorityDate | 2018-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.