http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200033222-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffbb78d41aa77e44c5824c866b672933 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fec481b7ef98c74252d2e171cd5252c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c1b7f9b2541419806e7662ed8bcbbdc |
| publicationDate | 2020-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20200033222-A |
| titleOfInvention | Method for manufacturing semiconductor device and laminated sheet |
| abstract | Electronic component placement process for placing electronic component 2 on laminated sheet 1 having adhesive sheet 12 and curable first resin composition layer 11, curable second resin composition layer 3 ), A lamination step of laminating the encapsulation sheet, a first cured layer (11 ＇) formed by curing the first resin composition layer 11, and a second made by curing the second resin composition layer (3) The pressure-sensitive adhesive sheet 12 is peeled together with the electronic component 2 sealed by the cured layer (3 ') of the first and the first cured layer (11') and the second cured layer (3 '). It includes a hardening process to obtain the encapsulation body 4, a hole forming process to form the holes 5, a desmear process to desmear the encapsulation 4, and an electrode formation process to form the electrode 6 Method for manufacturing a semiconductor device. The method for manufacturing such a semiconductor device can be applied to an efficient and high-yield method as well as to enable high integration and high functionality of the semiconductor device. |
| priorityDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 104.