| abstract |
The present invention is a polishing method for carrying out polishing by sliding a semiconductor silicon wafer held by a polishing head on a polishing cloth attached to a surface while supplying an abrasive, primary polishing, secondary polishing, and finishing polishing on a semiconductor silicon wafer. When sequentially performed, the secondary polishing consists of polishing with an alkali-based abrasive containing glass abrasives and not containing a water-soluble polymer, and rinsing with an abrasive containing water-soluble polymers thereafter. , After rinsing is performed in two stages of polishing, and after performing the first stage of rinsing while supplying an abrasive containing a water-soluble polymer, the average molecular weight of the water-soluble polymer is greater than that of the first-stage abrasive. Provided is a polishing method in which the second step of rinsing is performed while converting to and supplying. Accordingly, there is provided a method for polishing a semiconductor silicon wafer having a small surface defect, a small DIC defect, and a good surface roughness. |