| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a90ef4bcf3386d520050ee161b5bb70d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate |
2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9d5b46f30b3f5fc760ab8e6c2a96251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0d4d8e8debce4623d93eefd92f3ebae |
| publicationDate |
2020-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200027284-A |
| titleOfInvention |
Manufacturing method of high integration and flexibility FPCB for POLED display |
| abstract |
The present invention relates to a method for manufacturing a highly integrated, high-flexibility flexible printed circuit board for a POLED display using a semi-additive method, and more specifically, to form a copper clad laminate (FCCL) through a sputtering process to form an ultra-thin copper foil laminate according to the electrolytic copper plating conditions. It is possible to manufacture, and it is possible to realize a very narrow narrow pitch (Pitch) by forming a circuit by exposure of high resolution by using a low-resolution dry film with a thickness of less than 19 μm, for high-density, high-flexibility FPCB production. It relates to a method of manufacturing a highly integrated, high-flexibility flexible printed circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111447743-A |
| priorityDate |
2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |