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filingDate 2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ae24cf472f6410626fa9f9ad7ba0252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49131b2d239347a2aedb7523887da667
publicationDate 2020-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20200018377-A
titleOfInvention Resin particle, electroconductive particle, conductive material, adhesive agent, bonded structure, and liquid crystal display element
abstract It is possible to effectively suppress the occurrence of spring back, and also to provide a resin particle that can effectively suppress the occurrence of lifting or peeling. The resin particle which concerns on this invention is a polymer of the 1st polymeric compound which has one polymeric functional group, and has a cyclic organic group, and the 2nd polymeric compound which has two or more polymeric functional groups and has a cyclic organic group, Particles of the resin particles after heating when the weight ratio of the content of the structure derived from the first polymerizable compound to the content of the structure derived from the second polymerizable compound is 7 or more and the resin particles are heated at 150 ° C. for 1000 hours. The ratio with respect to the particle diameter of the resin particle before heating of a diameter is 0.9 or less.
priorityDate 2017-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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