| abstract |
Of the thermosetting resin composition which is excellent in the time-dependent fluctuation-resistance of the film thickness of the film | membrane formed from a thermosetting resin composition, and was excellent in the strength when it was set as the cured film, and its cured film, laminated body, a semiconductor device, and the manufacturing method thereof offer. PKa and acidic compounds of the conjugated acid of the amine compound, including a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, a salt containing a cation derived from an amine compound and an anion derived from an acidic compound, and a solvent. Thermosetting resin composition whose pKa is in the range of the following formula (1); 3.5≤ (pKa of conjugated acid of amine compound + pKa of acidic compound) /2≤7.1 (Formula 1). |