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filingDate 2018-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_399a6fd530c0dae66217bcabe87a2de5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9239e51954facb4f9f824d2a7ae2edcd
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publicationDate 2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20200015228-A
titleOfInvention Adhesive tape for sputtering for electromagnetic interference shielding of BGA package and method manufacturing the same
abstract Consists of a release liner, a UV-curable pressure-sensitive adhesive layer and a base film, the UV-curable pressure-sensitive adhesive is prepared by mixing an acrylic copolymer, an ultraviolet curable acrylic oligomer, a curing agent, a photopolymerization initiator and a reaction solvent, the acrylic copolymer is a soft monomer and hard A sputtering adhesive tape for shielding electromagnetic interference of a BGA package formed by polymerizing a monomer of a type in an appropriate ratio and a method of manufacturing the same are disclosed.
priorityDate 2018-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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